US Patent Issued to MURATA MANUFACTURING on Nov. 11 for "Radio-frequency module and communication apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,235, issued on Nov. 11, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio-frequency module and communication apparatus" was invented by Takanori Uejima (Kyoto, Japan), Hiromichi Kitajima (Kyoto, Japan), Naoya Matsumoto (Kyoto, Japan), Hisanori Murase (Kyoto, Japan), Nanami Yumura (Kyoto, Japan) and Yoichi Sawada (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; ...