ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,758, issued on Nov. 11, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Module" was invented by Shota Hayashi (Nagaokakyo, Japan), Nobuaki Ogawa (Nagaokakyo, Japan), Yuki Asano (Nagaokakyo, Japan), Takanori Uejima (Nagaokakyo, Japan), Hiromichi Kitajima (Nagaokakyo, Japan) and Takahiro Eguchi (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A metal member includes a plate-shaped portion extending upward from an upper main surface of a substrate, and has a front main surface and a back main surface arranged in the front-back direction when viewed in the up-down direction. A first electronic component is mounted on t...