US Patent Issued to MURATA MANUFACTURING on Nov. 11 for "Electronic component module comprising plurality of components and substrate including insulating layer, ground layer and ground bump" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,797, issued on Nov. 11, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).

"Electronic component module comprising plurality of components and substrate including insulating layer, ground layer and ground bump" was invented by Tadashi Nomura (Nagaokakyo, Japan) and Toru Komatsu (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component module includes a plurality of components including a terminal and placed along a plane, a frame substrate supporting at least some components among the plurality of components, a sealing resin portion sealing the plurality of components and the frame substrate, and a shiel...