ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,129, issued on May 6, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Module having a shield film and method of manufacturing the same" was invented by Tetsuya Oda (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant fr...