US Patent Issued to MURATA MANUFACTURING on May 6 for "High-frequency module having a compartment shield structure" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,975, issued on May 6, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module having a compartment shield structure" was invented by Yoshihito Otsubo (Nagaokakyo, Japan) and Takafumi Kusuyama (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a main substrate, a sub-module mounted on a first surface of the main substrate, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second...