US Patent Issued to MURATA MANUFACTURING on May 27 for "High-frequency module and communication device" (Japanese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,412, issued on May 27, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module and communication device" was invented by Yoichi Sawada (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module includes a module substrate having main surfaces, one or more module components disposed on the main surface, a resin member covering the main surface, and a metal shield layer covering a top surface of each of the resin member and the one or more module components, and set to ground potential. A sub-module component, which is one of the one or more module components, has a sub-module substrate having mai...