US Patent Issued to MURATA MANUFACTURING on May 20 for "Pressure sensor device, pressure sensor module, and signal correction method for pressure sensor module" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,050, issued on May 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Pressure sensor device, pressure sensor module, and signal correction method for pressure sensor module" was invented by Hideaki Sugibayashi (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pressure sensor device includes an electrically insulative substrate, a base electrode layer, spacer portions, a guard electrode layer, and a membrane plate. A sensing electrode portion and monitoring electrode portions are located on the membrane plate and face the substrate. In a case where the monitoring electrodes are mounted on a circuit board, the monito...