ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,913, issued on May 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Module" was invented by Yoshihito Otsubo (Nagaokakyo, Japan), Ryoichi Kita (Nagaokakyo, Japan) and Tadashi Nomura (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the sh...