US Patent Issued to MURATA MANUFACTURING on May 20 for "Electronic component module, sub-module, and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,932, issued on May 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Electronic component module, sub-module, and method for manufacturing same" was invented by Tsuyoshi Takakura (Nagaokakyo, Japan), Yoshihito Otsubo (Nagaokakyo, Japan), Tadashi Nomura (Nagaokakyo, Japan) and Hideo Nakagoshi (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to an electronic component module including: a substrate; an electronic component mounted on the substrate; and a sub-module mounted on the substrate, the sub-module including a wiring board, a first electronic component disposed on one of two ma...