US Patent Issued to MURATA MANUFACTURING on May 13 for "Module and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,628, issued on May 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Module and method for manufacturing same" was invented by Toru Komatsu (Nagaokakyo, Japan), Tadashi Nomura (Nagaokakyo, Japan) and Yukiya Yamaguchi (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate including a first surface, a first component mounted on first surface, and a first sealing resin sealing first component. First sealing resin contains a filler. An upper surface of first sealing resin includes a first region and a second region. A ratio of an area where the filler is exposed from first sealing resin in the se...