ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,502, issued on May 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Electronic component package" was invented by Tomofumi Kobayashi (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component package includes a base tape including recesses. On an inner surface of each of the recesses, a protrusion that can abut an electronic component inside of the recess is provided. The electronic component includes a multilayer body having a parallelepiped or substantially parallelepiped shape and an external electrode on each of two end surfaces of the multilayer body."
The patent was filed on March 7, 2023, unde...