ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,587, issued on May 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Electronic component module" was invented by Hideki Shinkai (Nagaokakyo, Japan) and Akio Katsube (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component module includes a substrate, a connector, an electronic component, a conductor wall, an insulating resin, and a conductive shield film. The connector and the electronic component are mounted on a first main surface of the substrate. The conductor wall has a cylindrical shape, is mounted on the first main surface of the substrate, and includes an interior space in which the connecto...