US Patent Issued to MURATA MANUFACTURING on March 4 for "Electronic component module, and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,245,363, issued on March 4, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Electronic component module, and method of manufacturing the same" was invented by Tadashi Nomura (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cap including a side wall portion having conductivity, a lid portion, a thin portion formed at least around the lid portion, and a beam portion supporting the lid portion is formed, an exposed component and a sealing component are mounted on a module substrate, the cap is mounted on the module substrate so as to surround an exposed component, the sealing component and the cap are sealed with a sealing...