US Patent Issued to MURATA MANUFACTURING on March 4 for "Electronic component module, and method of manufacturing electronic component module" (Japanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,858, issued on March 4, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Electronic component module, and method of manufacturing electronic component module" was invented by Toru Komatsu (Nagaokakyo, Japan) and Tadashi Nomura (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component module includes a substrate, a sub-module to be mounted on a main surface of the substrate, and a terminal conductor formed on a main surface of the substrate. The sub-module includes a substrate, an electronic component, an electronic component, and an electronic component. The substrate has a main surface and a main surfac...