ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,689, issued on March 4, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Chip ceramic electronic component and method for manufacturing the same" was invented by Kota Zenzai (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass. A glass-free conductive paste including a nickel powder, a metal powder, such as tin, having a melting point of lower than about 500deg C., and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic b...