ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,519, issued on March 25, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Module" was invented by Shota Hayashi (Nagaokakyo, Japan), Nobuaki Ogawa (Nagaokakyo, Japan), Yuki Asano (Nagaokakyo, Japan), Akihiro Muranaka (Nagaokakyo, Japan), Takanori Uejima (Nagaokakyo, Japan), Hiromichi Kitajima (Nagaokakyo, Japan) and Takahiro Eguchi (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first elec...