ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,151, issued on March 18, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Module" was invented by Yoshihito Otsubo (Nagaokakyo, Japan) and Yukio Yamamoto (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module (101) includes a substrate (1) having a first main surface (1a) and including wiring, a first component (31) having a circuit surface (31a), mounted on the first main surface (1a) such that the circuit surface (31a) faces the first main surface (1a), and having a ground terminal (10) on the circuit surface (31a), a first sealing resin (6a) disposed to cover the first main surface (1a) and the first componen...