US Patent Issued to MURATA MANUFACTURING on March 11 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,017, issued on March 11, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio frequency module and communication device" was invented by Dai Nakagawa (Kyoto, Japan), Takanori Uejima (Kyoto, Japan), Yuji Takematsu (Kyoto, Japan), Naoya Matsumoto (Kyoto, Japan), Ryohei Okabe (Kyoto, Japan) and Hiromichi Kitajima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic compon...