ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,465, issued on June 24, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Wiring board" was invented by Yoshiki Tobita (Nagaokakyo, Japan) and Issei Yamamoto (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes at least one insulating layer, plurality of conductive members, at least one land electrode formed at position overlapping first surface in plan view of insulating layer as viewed from first surface side, land electrode being connected to each of at least one conductive member, and coil conductor provided inside insulating layer or on second surface on back side of first surface in insulating ...