US Patent Issued to MURATA MANUFACTURING on June 24 for "Radio-frequency module and communication apparatus" (Japanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,548, issued on June 24, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio-frequency module and communication apparatus" was invented by Koji Furutani (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, and a metal layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted o...