US Patent Issued to MURATA MANUFACTURING on June 17 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,089, issued on June 17, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio frequency module and communication device" was invented by Yuji Takematsu (Kyoto, Japan), Takanori Uejima (Kyoto, Japan) and Dai Nakagawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an e...