US Patent Issued to MURATA MANUFACTURING on June 17 for "Multilayer board and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,093, issued on June 17, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer board and method of manufacturing the same" was invented by Kosuke Nishio (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer board includes thermoplastic resin layers laminated together, a first-class conductor pattern including a conductor foil on a first surface of one of the thermoplastic resin layers, a second-class conductor pattern in contact with a second surface of the one of the thermoplastic resin layers, and an interlayer connection conductor in the one of the thermoplastic resin layers and including a first end su...