US Patent Issued to MURATA MANUFACTURING on June 17 for "High-frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,086, issued on June 17, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module and communication device" was invented by Takanori Uejima (Kyoto, Japan), Hiromichi Kitajima (Kyoto, Japan), Takahiro Eguchi (Kyoto, Japan), Nobuaki Ogawa (Kyoto, Japan), Yuki Asano (Kyoto, Japan) and Shota Hayashi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface o...