US Patent Issued to MURATA MANUFACTURING on June 17 for "High frequency module and communication apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,898, issued on June 17, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High frequency module and communication apparatus" was invented by Naoya Matsumoto (Kyoto, Japan), Takanori Uejima (Kyoto, Japan), Yuji Takematsu (Kyoto, Japan) and Dai Nakagawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high frequency module includes a mounting substrate, an acoustic wave filter, a protection member, a resin layer, and a shield layer. The acoustic wave filter is mounted on a first main surface of the mounting substrate. The protection member is disposed on a main surface of the acoustic wave filter that is far from the mountin...