US Patent Issued to MURATA MANUFACTURING on June 10 for "Electronic component module and method of manufacturing electronic component module" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,857, issued on June 10, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Electronic component module and method of manufacturing electronic component module" was invented by Toru Komatsu (Nagaokakyo, Japan), Motohiko Kusunoki (Nagaokakyo, Japan) and Tadashi Nomura (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The e...