ALEXANDRIA, Va., July 9 -- United States Patent no. D1,082,577, issued on July 8, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Sensor cover package" was invented by Toru Shimuta (Kyoto, Japan).
The patent was filed on Aug. 23, 2022, under Application No. D/865,976.
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