US Patent Issued to MURATA MANUFACTURING on July 8 for "Semiconductor device and electronic apparatus with O-ring reinforcement structure" (Japanese Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,352,645, issued on July 8, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Semiconductor device and electronic apparatus with O-ring reinforcement structure" was invented by Yoshihiro Yoshida (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a detector mounted on a base substrate and including a pressure detector to detect pressure, a base portion on the base substrate where the detector is buried, a protruding portion protruding upward from the base portion and including an exposure hole which causes the pressure detector to be exposed upward, and a lid supported by an upper surface of the p...