ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,538, issued on July 8, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Electronic component module" was invented by Tadashi Nomura (Nagaokakyo, Japan) and Ryohei Okabe (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate, a component mounted on a top surface that is one principal surface of the substrate, a first shielding film provided on a top surface and a side surface of the component, a sealing resin provided on the top surface of the substrate and seals the component, and a second shielding film provided on a top surface of the sealing resin. A hole is provided on a top surface of the se...