US Patent Issued to MURATA MANUFACTURING on July 29 for "Circuit board and method of manufacturing circuit board" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,221, issued on July 29, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Circuit board and method of manufacturing circuit board" was invented by Kosuke Nishio (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A board main body includes first and second resin layers contacting each other and including thermoplastic resin, a first signal conductor layer on an upper main surface of the second resin layer, an overlapping region in which the first and second resin layers are present when viewed in an up-down direction, and a non-overlapping region in which the first resin layer is not present and the second resin layer is p...