US Patent Issued to MURATA MANUFACTURING on July 22 for "Method of manufacturing electronic component" (Japanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,254, issued on July 22, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Method of manufacturing electronic component" was invented by Satoshi Yokomizo (Nagaokakyo, Japan), Shinobu Chikuma (Nagaokakyo, Japan) and Yohei Mukobata (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing an electronic component includes applying a paste at two locations on a board main surface of a board made of alumina and applying a glass paste between the two locations, heating the board, cutting two locations where a fired layer is provided, forming a layer on an outer periphery in a vicinity of a board end surface, f...