ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,327, issued on July 1, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Module" was invented by Shota Hayashi (Nagaokakyo, Japan), Nobuaki Ogawa (Nagaokakyo, Japan), Yuki Asano (Nagaokakyo, Japan), Akihiro Muranaka (Nagaokakyo, Japan), Takanori Uejima (Nagaokakyo, Japan) and Hiromichi Kitajima (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate and a first metal member. The substrate has an upper main surface and a lower main surface arranged in an up-down direction. The first metal member includes a first plate-shaped portion provided on the upper main surface of the substrate, and includes a...