US Patent Issued to MURATA MANUFACTURING on Jan. 27 for "High-frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,796, issued on Jan. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module and communication device" was invented by Hiroyuki Kani (Kyoto, Japan), Yoshihiro Yoshimura (Kyoto, Japan), Takahiro Yamashita (Kyoto, Japan), Ryo Wakabayashi (Kyoto, Japan), Takashi Hirose (Kyoto, Japan) and Kiyoshi Aikawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and ...