ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,506, issued on Jan. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Acoustic wave device" was invented by Keiji Okada (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device includes a package substrate including first and second principal surfaces, an acoustic wave element at the first principal surface, a sealing resin layer covering at least a portion of the acoustic wave element, and a metal shield film covering the sealing resin layer. The package substrate includes a ground connection electrode in the package substrate, electrically connected to the acoustic wave element, and connected to a ...