ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,182, issued on Jan. 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Electronic component" was invented by Hirofumi Oie (Nagaokakyo, Japan) and Masahiro Teramoto (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal s...