US Patent Issued to MURATA MANUFACTURING on Jan. 13 for "Semiconductor composite device and method for manufacturing semiconductor composite device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,597, issued on Jan. 13, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Semiconductor composite device and method for manufacturing semiconductor composite device" was invented by Tatsuya Kitamura (Nagaokakyo, Japan), Koshi Himeda (Nagaokakyo, Japan) and Takeshi Furukawa (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor composite device includes active elements and passive elements constituting a voltage regulator and disposed in association with a plurality of channels, a load to be supplied with a direct-current voltage regulated by the voltage regulator, and a wiring board electrically connected...