ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,005, issued on Jan. 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio-frequency module and communication device" was invented by Motoji Tsuda (Kyoto, Japan), Mikiko Fukasawa (Kyoto, Japan), Shunji Yoshimi (Kyoto, Japan) and Satoshi Goto (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio-frequency module includes a module substrate that has a principal surface, an integrated circuit on the principal surface that includes a power amplifier circuit, and an SMD on the principal surface that includes a circuit device directly connected to the power amplifier circuit. The integrated circuit includes a first base th...