US Patent Issued to MURATA MANUFACTURING on Jan. 13 for "Multilayer resin substrate and electronic component" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,911, issued on Jan. 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer resin substrate and electronic component" was invented by Kenji Matsuda (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer resin substrate includes first and second substrates joined to overlap each other, a first signal electrode on a joint surface between the first and second substrates, a first via-conductor in the first substrate and joined to the first signal electrode, a first ground electrode in or on the second substrate and overlapping the first signal electrode, a first floating electrode in the second substrate and...