US Patent Issued to MURATA MANUFACTURING on Jan. 13 for "High-frequency module and communication device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,932, issued on Jan. 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module and communication device" was invented by Yukiya Yamaguchi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module includes: a module substrate that has major surfaces that face each other; a plurality of post electrodes placed on the major surface; and a power amplification component placed on the major surface. The power amplification component includes: a base material that has major surfaces and that face each other, the major surface being located between the major surface and the major surface; an amplificat...