US Patent Issued to MURATA MANUFACTURING on Jan. 13 for "High-frequency module and communication device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,004, issued on Jan. 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module and communication device" was invented by Teruaki Oshita (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a high-frequency module that can be reduced in size while securing an external connection member. A high-frequency module includes a mounting substrate, an electronic component, and a resin layer. The electronic component is mounted on a main surface of the mounting substrate. The resin layer is provided on the mounting substrate and covers a side surface of the electronic component. The electronic component include...