US Patent Issued to MURATA MANUFACTURING on Jan. 13 for "Circuit module" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,513, issued on Jan. 13, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Circuit module" was invented by Takanari Okada (Nagaokakyo, Japan) and Yasutaka Maeda (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit module includes a substrate module including an upper main surface with a normal line extending in a vertical direction, an electronic component on the substrate module, and a bonding adhesive fixing the electronic component to the upper main surface. The electronic component includes a first electrode. The substrate module includes a second electrode on the right of the bonding adhesive. The first electr...