ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,269, issued on Feb. 18, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Electronic component module" was invented by Takahiro Kitazume (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component module includes a substrate, an inductor element, a plurality of mounting type electronic components, and a shield film. The substrate has a first main surface and a second main surface, and the second main surface side is a side to be mounted on another circuit board. A first mounting type electronic component and a second mounting type electronic component are mounted on the first main surface. The shield film c...