US Patent Issued to MURATA MANUFACTURING on Feb. 11 for "Package module comprising marking and shield films and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,249, issued on Feb. 11, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Package module comprising marking and shield films and method of manufacturing the same" was invented by Toru Komatsu (Nagaokakyo, Japan) and Tadashi Nomura (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module is disclosed that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, a marking film covering at least an upper surface of the first sealing resin, and a shield film covering the marking f...