ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,485, issued on Dec. 9, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-fu, Japan).
"Module and component" was invented by Yoshihito Otsubo (Nagaokakyo, Japan) and Minoru Hatase (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes: a substrate including a first surface and including first and second sides; a component as a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; and a first shield film. An inclined portion is formed in the substrate. The substrate includes a first lead electrode arranged to be exposed to the inclined portion alo...