ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,501, issued on Dec. 9, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Module" was invented by Yoshihito Otsubo (Nagaokakyo, Japan) and Takafumi Kusuyama (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate."
The patent was filed on Dec. 6, 2022, under Application No. 18/062,176....