ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,271, issued on Dec. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Electronic component" was invented by Daisuke Hamada (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component includes first solid solution layer in which a first metal component as a primary component defining a solid solution with a second metal component is located at an interface with a dielectric layer in an end region nearer than a position that is about 5% or more and about 20% or less of a length-direction distance or about 10 micro metre or more and about 50 micro metre or less from an end surface of an extended portion of...