ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,812, issued on Dec. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Acoustic wave device" was invented by Katsuya Daimon (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device includes a support substrate, a first high acoustic velocity film on the support substrate, a low acoustic velocity film on the first high acoustic velocity film, a second high acoustic velocity film on the low acoustic velocity film, a piezoelectric layer on the second high acoustic velocity film, and an IDT on the piezoelectric layer. Bulk waves propagate in the low acoustic velocity film more slowly than bulk waves propa...