US Patent Issued to MURATA MANUFACTURING on Dec. 23 for "High-frequency module and communication device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,453, issued on Dec. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module and communication device" was invented by Yukiya Yamaguchi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module includes: a module substrate that has major surfaces that face each other; a resin member for covering at least a part of the major surface; a shield electrode layer for covering at least a part of a surface of the resin member; a plurality of post electrodes placed on the major surface; a power amplification component placed on the major surface; and a first metal electrode (for example, a shield ele...