US Patent Issued to MURATA MANUFACTURING on Dec. 16 for "High-frequency module and communication device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,587, issued on Dec. 16, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"High-frequency module and communication device" was invented by Rui Tanaka (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a high-frequency module, a plurality of signal paths of a switch circuit include a plurality of switching elements that switch a connection form between a plurality of common terminals and a plurality of selection terminals. At least one signal path among the plurality of signal paths of the switch circuit includes a first wiring pattern portion included in the IC chip, and a second wiring pattern portion included in ...