US Patent Issued to MURATA MANUFACTURING on Aug. 5 for "Radio-frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,576, issued on Aug. 5, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio-frequency module and communication device" was invented by Dai Nakagawa (Kyoto, Japan), Takanori Uejima (Kyoto, Japan), Yuji Takematsu (Kyoto, Japan) and Yukiya Yamaguchi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a first transmission filter, a second transmission filter, a resin layer, and a shield layer. The second transmission filter is higher in power class than the first transmission filter. The resin layer covers at least part...