ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,921, issued on Aug. 26, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Through-interposer grounding using blind vias" was invented by Stephane Bouvier (Cairon, France), Emmanuel Lefeuvre (Caen, France) and Frederic Voiron (Barraux, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "A current path is provided through an interposer to ground a grounding pattern associated with a transmission line, by exploiting an interposer substrate that has a high-resistivity portion at a first surface and a low-resistivity portion extending from the high-resistivity portion to a second surface of the interposer. Moreover, a set of blind via...